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TC1070/TC1071/TC1187
50mA, 100mA and 150mA Adjustable CMOS LDOs with Shutdown
Features:
* * * * * * * * 50 A Ground Current for Longer Battery Life Adjustable Output Voltage Very Low Dropout Voltage Choice of 50 mA (TC1070), 100 mA (TC1071) and 150 mA (TC1187) Output Power-Saving Shutdown Mode Over Current and Over Temperature Protection Space-Saving 5-Pin SOT-23 Package Pin Compatible with Bipolar Regulators
General Description:
The TC1070, TC1071 and TC1187 are adjustable LDOs designed to supersede a variety of older (bipolar) voltage regulators. Total supply current is typically 50 A at full load (20 to 60 times lower than in bipolar regulators). The devices' key features include ultra low-noise operation, very low dropout voltage - typically 85 mV (TC1070); 180 mV (TC1071); and 270 mV (TC1187) at full load, and fast response to step changes in load. Supply current is reduced to 0.5 A (maximum) when the shutdown input is low. The devices incorporate both over-temperature and over-current protection. Output voltage is programmed with a simple resistor divider from VOUT to ADJ to GND. The TC1070, TC1071 and TC1187 are stable with an output capacitor of only 1 F and have a maximum output current of 50 mA, 100 mA and 150 mA, respectively. For higher output versions, please see the TC1174 (IOUT = 300 mA) data sheet.
Applications:
* * * * * * * Battery Operated Systems Portable Computers Medical Instruments Instrumentation Cellular/GSM/PHS Phones Linear Post-Regulators for SMPS Pagers
Typical Application
VIN 1 VIN VOUT 5 C1 + 1 F VOUT
Package Type
5-Pin SOT-23 VOUT 5
R1
2
TC1070 TC1071 TC1187
GND
ADJ 4 TC1070 TC1071 TC1187
3 SHDN ADJ
4
1
R2
2
3
VIN
Shutdown Control (from Power Control Logic) VOUT = VREF x
GND SHDN
[ R1 +1] R2
(c) 2007 Microchip Technology Inc.
DS21353D-page 1
TC1070/TC1071/TC1187
1.0 ELECTRICAL CHARACTERISTICS
*Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.
Absolute Maximum Ratings*
Input Voltage .........................................................6.5V Output Voltage........................... (-0.3V) to (VIN + 0.3V) Power Dissipation................Internally Limited (Note 5) Maximum Voltage on Any Pin ........VIN +0.3V to -0.3V Operating Temperature Range...... -40C < TJ < 125C Storage Temperature..........................-65C to +150C
ELECTRICAL SPECIFICATIONS
Electrical Characteristics: VIN = VOUT + 1V, IL = 0.1 mA, CL = 3.3 F, SHDN > VIH, TA = 25C, unless otherwise noted. Boldface type specifications apply for junction temperatures of -40C to +125C. Symbol VIN IOUTMAX Parameter Input Operating Voltage Maximum Output Current Min 2.7 50 100 150 VREF 1.165 -- -- TC1070; TC1071 TC1187 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- 45 Typ -- -- -- -- -- 1.20 40 0.05 0.5 0.5 2 65 85 180 270 50 0.05 64 300 0.04 160 10 260 -- Max 6.0 -- -- -- 5.5 1.235 -- 0.35 2 3 -- -- 120 250 400 80 0.5 -- 450 -- -- -- -- -- Units V mA Test Conditions Note 6 TC1070 TC1071 TC1187
VOUT VREF VREF/T VOUT/VIN VOUT/VOUT
Adjustable Output Voltage Range Reference Voltage VREF Temperature Coefficient Line Regulation Load Regulation
V V ppm/C % % Note 1 (VR + 1V) VIN 6V IL = 0.1 mA to IOUTMAX IL = 0.1 mA to IOUTMAX (Note 2) IL = 0.1 mA IL = 20 mA IL = 50 mA IL = 100 mA IL = 150 mA (Note 3) SHDN = VIH, IL = 0 SHDN = 0V FRE 1 kHz VOUT = 0V Note 4
VIN-VOUT
Dropout Voltage
mV
TC1071; TC1187 TC1187 IIN IINSD PSRR IOUTSC VOUT/PD TSD TSD eN SHDN Input VIH SHDN Input High Threshold
VOUT x T 2: 3: 4: 5: 6:
Supply Current Shutdown Supply Current Power Supply Rejection Ratio Output Short Circuit Current Thermal Regulation Thermal Shutdown Die Temperature Thermal Shutdown Hysteresis Output Noise
A A dB mA V/W C C nV/Hz %VIN
IL = IOUTMAX VIN = 2.5V to 6.5V
Note 1: TC VOUT = (VOUTMAX - VOUTMIN) x 106
Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 ms. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 "Thermal Considerations" for more details. The minimum VIN has to justify the conditions: VIN VR + VDROPOUT and VIN 2.7V for IL = 0.1 mA to IOUTMAX.
DS21353D-page 2
(c) 2007 Microchip Technology Inc.
TC1070/TC1071/TC1187
ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: VIN = VOUT + 1V, IL = 0.1 mA, CL = 3.3 F, SHDN > VIH, TA = 25C, unless otherwise noted. Boldface type specifications apply for junction temperatures of -40C to +125C. Symbol VIL ADJ Input IADJ Adjust Input Leakage Current
6
Parameter SHDN Input Low Threshold
Min -- --
Typ -- 50
Max 15 --
Units %VIN pA
Test Conditions VIN = 2.5V to 6.5V
Note 1: TC VOUT = (VOUTMAX - VOUTMIN) x 10
VOUT x T 2: 3: 4: 5: 6:
Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 ms. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 "Thermal Considerations" for more details. The minimum VIN has to justify the conditions: VIN VR + VDROPOUT and VIN 2.7V for IL = 0.1 mA to IOUTMAX.
(c) 2007 Microchip Technology Inc.
DS21353D-page 3
TC1070/TC1071/TC1187
2.0
Note:
TYPICAL CHARACTERISTICS
Note: Unless otherwise specified, all parts are measured at temperature = +25C) The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
0.020 0.018
Dropout Voltage vs. Temperature (VOUT = 3.3V)
0.100 0.090
DROPOUT VOLTAGE (V)
Dropout Voltage vs. Temperature (VOUT = 3.3V) ILOAD = 50mA
ILOAD = 10mA
DROPOUT VOLTAGE (V)
0.016 0.014 0.012 0.010 0.008 0.006 0.004 0.002 0.000 -40 -20 0 20 50 TEMPERATURE (C) 70 125
0.080 0.070 0.060 0.050 0.040 0.030 0.020 0.010 0.000 -40 -20 0 20 50 TEMPERATURE (C) 70 125
CIN = 1F COUT = 1F
CIN = 1F COUT = 1F
0.020 0.018
DROPOUT VOLTAGE (V)
Dropout Voltage vs. Temperature (VOUT = 3.3V) ILOAD = 10mA
DROPOUT VOLTAGE (V)
0.300 0.250 0.200 0.150 0.100 0.050 0.000
Dropout Voltage vs. Temperature (VOUT = 3.3V) ILOAD = 150mA
0.016 0.014 0.012 0.010 0.008 0.006 0.004 0.002 0.000 -40 -20 0 20 50 TEMPERATURE (C) 70 125
CIN = 1F COUT = 1F
CIN = 1F COUT = 1F
-40 -20 0 20 50 TEMPERATURE (C) 70 125
90 80
Ground Current vs. VIN (VOUT = 3.3V) ILOAD = 10mA
GND CURRENT (A)
90 80 70 60 50 40 30 20 10 0
Ground Current vs. VIN (VOUT = 3.3V) ILOAD = 100mA
GND CURRENT (A)
70 60 50 40 30 20 10 0
CIN = 1F COUT = 1F
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5 VIN (V)
CIN = 1F COUT = 1F
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5
VIN (V)
DS21353D-page 4
(c) 2007 Microchip Technology Inc.
TC1070/TC1071/TC1187
TYPICAL CHARACTERISTICS (CONTINUED)
Note: Unless otherwise specified, all parts are measured at temperature = +25C)
80 70
GND CURRENT (A)
Ground Current vs. VIN (VOUT = 3.3V) ILOAD = 150mA
3.5
VOUT vs. VIN (VOUT = 3.3V) ILOAD = 0
3 2.5
60
VOUT (V)
50 40 30 20 10 0
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5 VIN (V)
2 1.5 1
CIN = 1F COUT = 1F
0.5 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
CIN = 1F COUT = 1F
5.5 6 6.5 7
VIN (V)
3.5 3.0 2.5 VOUT (V) 2.0 1.5 1.0 0.5 0.0
0
VOUT vs. VIN (VOUT = 3.3V) ILOAD = 100mA
3.320 3.315 3.310 3.305
Output Voltage vs. Temperature (VOUT = 3.3V) ILOAD = 10mA
VOUT (V)
3.300 3.295 3.290 3.285
CIN = 1F COUT = 1F
0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 VIN (V)
3.280 3.275 -40
CIN = 1F COUT = 1F VIN = 4.3V
-20 -10 0 20 40 85 125
TEMPERATURE (C)
3.290 3.288 3.286
Output Voltage vs. Temperature (VOUT = 3.3V) ILOAD = 150mA
VOUT (V)
3.284 3.282 3.280 3.278 3.276 3.274 -40 -20 -10 0 20 40 85 125
CIN = 1F COUT = 1F VIN = 4.3V
TEMPERATURE (C)
(c) 2007 Microchip Technology Inc.
DS21353D-page 5
TC1070/TC1071/TC1187
TYPICAL CHARACTERISTICS (CONTINUED)
Note: Unless otherwise specified, all parts are measured at temperature = +25C)
5.025 5.020 5.015
Output Voltage vs. Temperature (VOUT = 5V) ILOAD = 10mA
4.994 4.992 4.990 4.988
Output Voltage vs. Temperature (VOUT = 5V) ILOAD = 150mA
VOUT (V)
5.005 5.000 4.995 4.990 4.985
VOUT (V)
VIN = 6V CIN = 1F COUT = 1F
-40 -20 -10 0 20 40 85 125
5.010
4.986 4.984 4.982 4.980 4.978 4.976 4.974 -40 -20 -10 0 20 40 85 125
VIN = 6V CIN = 1F COUT = 1F
TEMPERATURE (C)
TEMPERATURE (C)
70 60
Temperature vs. Quiescent Current (VOUT = 5V) ILOAD = 10mA
GND CURRENT (A)
80 70 60 50 40 30 20 10 0
Temperature vs. Quiescent Current (VOUT = 5V)
ILOAD = 150mA
GND CURRENT (A)
50 40 30 20 10 0 -40 -20 -10 0 20 40 TEMPERATURE (C) 85 125
VIN = 6V CIN = 1F COUT = 1F
VIN = 6V CIN = 1F COUT = 1F
-40
-20
-10
0
20
40
85
125
TEMPERATURE (C)
Output Noise vs. Frequency 10.0 1000 RLOAD = 50 COUT = 1F CIN = 1F COUT ESR ()
Stability Region vs. Load Current COUT = 1F to 10F -30 -35 -40 100 10 1 Stable Region PSRR (dB) -45 -50 -55 -60 -65 0.1 -70 -75
Power Supply Rejection Ratio IOUT = 10mA VINDC = 4V VINAC = 100mVp-p VOUT = 3V CIN = 0 COUT = 1F
NOISE (V/Hz)
1.0
0.1
0.0 0.01K 0.1K
0.01 1K 10K 100K 1000K FREQUENCY (Hz) 0 10 20 30 40 50 60 70 80 90 100 LOAD CURRENT (mA)
-80 0.01K 0.1K
1K 10K 100K 1000K FREQUENCY (Hz)
DS21353D-page 6
(c) 2007 Microchip Technology Inc.
TC1070/TC1071/TC1187
TYPICAL CHARACTERISTICS (CONTINUED)
Note: Unless otherwise specified, all parts are measured at temperature = +25C)
Measure Rise Time of 3.3V LDO Conditions: CIN = 1F, COUT = 1F, ILOAD = 100mA, VIN = 4.3V, Temp = 25C, Fall Time = 184S
Thermal Shutdown Response of 5.0V LDO Conditions: VIN = 6V, CIN = 0F, COUT = 1F
VSHDN
VOUT
VOUT
ILOAD was increased until temperature of die reached about 160C, at which time integrated thermal protection circuitry shuts the regulator off when die temperature exceeds approximately 160C. The regulator remains off until die temperature drops to approximately 150C.
Measure Rise Time of 5.0V LDO Conditions: CIN = 1F, COUT = 1F, ILOAD = 100mA, VIN = 6V, Temp = 25C, Fall Time = 192S
Measure Fall Time of 3.3V LDO Conditions: CIN = 1F, COUT = 1F, ILOAD = 100mA, VIN = 4.3V, Temp = 25C, Fall Time = 52S
VSHDN
VSHDN
VOUT
VOUT
(c) 2007 Microchip Technology Inc.
DS21353D-page 7
TC1070/TC1071/TC1187
TYPICAL CHARACTERISTICS (CONTINUED)
Note: Unless otherwise specified, all parts are measured at temperature = +25C)
Measure Fall Time of 5.0V LDO Conditions: CIN = 1F, COUT = 1F, ILOAD = 100mA, VIN = 6V, Temp = 25C, Fall Time = 88S
VSHDN
VOUT
DS21353D-page 8
(c) 2007 Microchip Technology Inc.
TC1070/TC1071/TC1187
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
Pin No. (5-Pin SOT-23) 1 2 3 4 5
PIN FUNCTION TABLE
Symbol VIN GND SHDN ADJ VOUT Unregulated supply input. Ground terminal. Shutdown control input. Output voltage adjust terminal. Regulated voltage output. Description
3.1
Input Voltage Supply (VIN)
3.4
Output Voltage Adjust (ADJ)
Connect unregulated input supply to the VIN pin. If there is a large distance between the input supply and the LDO regulator, some input capacitance is necessary for proper operation. A 1 F capacitor connected from VIN to ground is recommended for most applications.
Output voltage setting is programmed with a resistor divider from VOUT to this input. A capacitor may also be added to this input to reduce output noise (see Section 4.2 "Output Capacitor").
3.5
Regulated Voltage Output (Vout)
3.2
Ground (GND)
Connect the unregulated input supply ground return to GND. Also connect the negative side of the 1 F typical input decoupling capacitor close to GND and the negative side of the output capacitor C1 to GND.
Connect the output load to VOUT of the LDO. Also connect the positive side of the LDO output capacitor as close as possible to the VOUT pin.
3.3
Shutdown Control Input (SHDN)
The regulator is fully enabled when a logic high is applied to this input. The regulator enters shutdown when a logic low is applied to this input. During shutdown, output voltage falls to zero and supply current is reduced to 0.5 A (maximum).
(c) 2007 Microchip Technology Inc.
DS21353D-page 9
TC1070/TC1071/TC1187
4.0 DETAILED DESCRIPTION
4.1 Adjust Input
The TC1070, TC1071 and TC1187 are adjustable output voltage regulators. (If a fixed version is desired, please see the TC1014/TC1015/TC1185 data sheet.) Unlike bipolar regulators, the TC1070, TC1071 and TC1187 supply current does not increase with load current. In addition, VOUT remains stable and within regulation over the entire 0 mA to IOUTMAX operating load current range, (an important consideration in RTC and CMOS RAM battery back-up applications). Figure shows a typical application circuit. The regulator is enabled any time the shutdown input (SHDN) is at or above VIH, and shutdown (disabled) when SHDN is at or below VIL. SHDN may be controlled by a CMOS logic gate, or I/O port of a microcontroller. If the SHDN input is not required, it should be connected directly to the input supply. While in shutdown, supply current decreases to 0.05 A (typical), VOUT falls to zero volts. The output voltage setting is determined by the values of R1 and R2 (Equation 4-1). The ohmic values of these resistors should be between 470K and 3M to minimize bleeder current. The output voltage setting is calculated using the following equation.
EQUATION 4-1:
VOUT = VREF x
[
R1 + 1] R2
The voltage adjustment range of the TC1070, TC1071 and TC1187 is from VREF to (VIN - 0.05V). If so desired, a small capacitor (10 pF to 0.01 F) may be added to the ADJ input to further reduce output noise.
4.2
Output Capacitor
3.0V Battery
+
1 VIN + C1 1 F
VOUT
5 C2 + 1 F R1 470K
+2.45V
TC1070 TC1071 TC1187
2
GND
3
SHDN
ADJ
4
C3 100 pF to 0.01 F (Optional) Shutdown Control (from Power Control Logic)
R2 470K
FIGURE 4-1:
Battery-Operated Supply
A 1 F (minimum) capacitor from VOUT to ground is recommended. The output capacitor should have an effective series resistance greater than 0.1 and less than 5.0, and a resonant frequency above 1 MHz. A 1 F capacitor should be connected from VIN to GND if there is more than 10 inches of wire between the regulator and the AC filter capacitor, or if a battery is used as the power source. Aluminum electrolytic or tantalum capacitor types can be used. (Since many aluminum electrolytic capacitors freeze at approximately -30C, solid tantalums are recommended for applications operating below -25C.) When operating from sources other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques.
DS21353D-page 10
(c) 2007 Microchip Technology Inc.
TC1070/TC1071/TC1187
5.0
5.1
THERMAL CONSIDERATIONS
Thermal Shutdown
Equation 5-1 can be used in conjunction with Equation 4-2 to ensure regulator thermal operation is within limits. For example: Given: VINMAX VOUTMIN ILOADMAX TJMAX TAMAX = 3.0V 10% = 2.7V - 2% = 40 mA = 125C = 55C
Integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 160C. The regulator remains off until the die temperature drops to approximately 150C.
5.2
Power Dissipation
The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. The following equation is used to calculate worst-case actual power dissipation:
Find: 1. Actual power dissipation 2. Maximum allowable dissipation Actual power dissipation: PD (VINMAX - VOUTMIN)ILOADMAX = [(3.0 x 1.10) - (2.7 x .0.98)]40 x 10-3 = 26.2 mW Maximum allowable power dissipation: PDMAX = (TJMAX - TAMAX) = (125 - 55) 220 = 318 mW In this example, the TC1070 dissipates a maximum of 26.2 mW which is below the allowable limit of 318 mW. In a similar manner, Equation 5-1 and Equation 5-2 can be used to calculate maximum current and/or input voltage limits.
EQUATION 5-1:
P D (VINmax - VOUTmin)ILOADmax Where: PD VINMAX VOUTMIN ILOADMAX = Worst-case actual power dissipation = Maximum voltage on VIN = Minimum regulator output voltage = Maximum output (load) current
JA
The maximum allowable power dissipation (Equation 4-2) is a function of the maximum ambient temperature (TAMAX), the maximum allowable die temperature (TJMAX) and the thermal resistance from junction-to-air (JA). The 5-Pin SOT-23 package has a JA of approximately 220 C/Watt.
EQUATION 5-2:
PDMAX = (TJMAX - TAMAX)
5.3
JA
Layout Considerations
where all terms are previously defined.
The primary path of heat conduction out of the package is via the package leads. Therefore, layouts having a ground plane, wide traces at the pads, and wide power supply bus lines combine to lower JA and therefore increase the maximum allowable power dissipation limit.
(c) 2007 Microchip Technology Inc.
DS21353D-page 11
TC1070/TC1071/TC1187
6.0
6.1
PACKAGING INFORMATION
Package Marking Information
5-Lead SOT-23-5 Example: TC1070 Code BANN TC1071 Code BBNN TC1187 Code R9NN
XXNN
(V) Adjustable
XXNN
Legend: XX...X Y YY WW NNN
e3
* Note:
Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.
6.2
Taping Form
Component Taping Orientation for 5-Pin SOT-23 (EIAJ SC-74A) Devices User Direction of Feed Device Marking W
PIN 1
P Standard Reel Component Orientation for TR Suffix Device (Mark Right Side Up)
Carrier Tape, Number of Components Per Reel and Reel Size: Package 5-Pin SOT-23 Carrier Width (W) 8 mm Pitch (P) 4 mm Part Per Full Reel 3000 Reel Size 7 in.
DS21353D-page 12
(c) 2007 Microchip Technology Inc.
TC1070/TC1071/TC1187
5-Lead Plastic Small Outline Transistor (OT) [SOT-23]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
b N
E E1
1 e
2
3
e1 D
A
A2
c
A1
L L1
Units Dimension Limits Number of Pins Lead Pitch Outside Lead Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Footprint Foot Angle Lead Thickness N e e1 A A2 A1 E E1 D L L1 c 0.90 0.89 0.00 2.20 1.30 2.70 0.10 0.35 0 0.08 MIN MILLIMETERS NOM 5 0.95 BSC 1.90 BSC - - - - - - - - - - 1.45 1.30 0.15 3.20 1.80 3.10 0.60 0.80 30 0.26 MAX
Lead Width b 0.20 - 0.51 Notes: 1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side. 2. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-091B
(c) 2007 Microchip Technology Inc.
DS21353D-page 13
TC1070/TC1071/TC1187
DS21353D-page 14
(c) 2007 Microchip Technology Inc.
TC1070/TC1071/TC1187
APPENDIX A: REVISION HISTORY
Revision D (March 2007)
* Ground current changed to 50 A. * Package type changed to SOT-23. * Section 3.0 "Pin Descriptions": Added pin descriptions. * Section 6.0 "Packaging Information": Updated packaging information.
Revision C (January 2006)
* Undocumented changes.
Revision B (May 2002)
* Undocumented changes.
Revision A (March 2002)
* Original Release of this Document.
(c) 2007 Microchip Technology Inc.
DS21353D-page 15
TC1070/TC1071/TC1187
NOTES:
DS21353D-page 16
(c) 2007 Microchip Technology Inc.
TC1070/TC1071/TC1187
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X Temperature Range XXXXX Package Examples:
a) b) Device TC1070: 50 mA, Adjustable CMOS LDO w/Shutdown TC1071: 100 mA, Adjustable CMOS LDO w/Shutdown TC1187: 150 mA, Adjustable CMOS LDO w/Shutdown V = -40C to +125C Plastic small outline transistor (OT) SOT-23, 5 lead, (tape and reel). c) TC1070VCT713: TC1071VCT713: TC1187VCT713: 50 mA, Adjustable 5LD SOT-23 package 100 mA, Adjustable, 5LD SOT-23 package 150 mA, Adjustable 5LD SOT-23 package
Temperature Range Package
CT713 =
(c) 2007 Microchip Technology Inc.
DS21353D-page 17
TC1070/TC1071/TC1187
NOTES:
DS21353D-page 18
(c) 2007 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: * * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable."
* *
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.
Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Linear Active Thermistor, Migratable Memory, MXDEV, MXLAB, PS logo, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2007, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona, Gresham, Oregon and Mountain View, California. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
(c) 2007 Microchip Technology Inc.
DS21353D-page 19
WORLDWIDE SALES AND SERVICE
AMERICAS
Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509
ASIA/PACIFIC
Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Habour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China - Fuzhou Tel: 86-591-8750-3506 Fax: 86-591-8750-3521 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China - Shunde Tel: 86-757-2839-5507 Fax: 86-757-2839-5571 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China - Xian Tel: 86-29-8833-7250 Fax: 86-29-8833-7256
ASIA/PACIFIC
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EUROPE
Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820
12/08/06
DS21353D-page 20
(c) 2007 Microchip Technology Inc.

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